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FR4 Multilayer PCB Board With Red Solder Mask
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  • Product Category: PCB Assembly
  • product description:PCB Assembly Sample Introduction Product Details: Payment & Shipping Terms: Detailed Product Description FR4 Multilayer PCB Board With Red Solder Mask RoHS Rigid Turnkey Specification: Base Material: FR4 Layer:2 Thickness: 1.6MM Copper weight:1OZ Surface finish: HASL Features: Base Material
  • PCB Assembly Sample Introduction

    Product Details:

    Place of Origin:

    China

    Brand Name:

    OEM

    Certification:

    CE,FCC,Rohs,ISO9001,SGS,UL

    Model Number:

    OEM

    Payment & Shipping Terms:

    Minimum Order Quantity:

    1PCS

    Price:

    USD 1-500

    Packaging Details:

    inner vacuum package, outer carton box

    Payment Terms:

    Western Union, L/C, T/T

    Supply Ability:

    10000000pcs / per month

    Detailed Product Description

    Color:

    Green

    Layer:

    4

    Board Size:

    6*1.8cm

    Board THK:

    1.6mm

    Cu THK:

    35UM

    Panel Size:

    1*10

    FR4 Multilayer PCB Board With Red Solder Mask RoHS Rigid Turnkey 

    Specification:

    Base Material: FR4

    Layer:2

    Thickness: 1.6MM

    Copper weight:1OZ

    Surface finish: HASL

    Features:

    Base Material: Aluminum/FR4/CEM1/CEM3

    Layer: 1 layer/2 layers

    Board Thickness: 0.3-3mm

    Min.Board Dimension: 4x4mm

    Max.Board Dimension: 1500x600mm

    Copper layer: 1oz/2oz/3oz

    Solder Mask: White/Black/Blue/Red

    Silkscreen: Black/White

    Surface finish: LF HAL/HAL/OSP/Gold immersion/Silver plating

    Outline Profile: CNC routing/V-Cut/Punching

    All of the parameters can be customized!

    Since the day of company foundation we continuously enaged in researching special and high precision printed circuit boards with the strong production capability of 2 to 28 layers of highly precise impedence,multi-layer blind buried,multi-layer mix-compression,highTG, copper substrate,Ceramic substrate PCB.we emphasize the significance of traning program for every single staff in the company even grass-roots employees which becomes the most competitive factors to excel from others,our company have many experienced and professional teams from management to production line,30% are highly educated among the total amount of employees,advanced engineers and senior technicians are up to 80 people.

    With advanced foreign technology supports and domestic 3G/4G device manufacturer in microwave pcb field which lead our experienced hi-frequencey researching team to one step ahead of the line of printed circuit board business,we are hornored to obtain sound reputations over our wolrdwide customers on the basis of fine qulity,prompt delivery,satisfied after sales service for may years and we assure our customers that we will return the favors with more and more superior products in the near future.

    Parameter:

    Layer No.

    1-16

    Min board thickness

    2 layer 0.2mm

    4 layer 0.4mm

    6 layer 0.6mm

    8 layer 0.8mm

    10 layer 1.0mm

    Max panel size

    508*610mm

    Board thickness tolerance

    T≥0.8mm±8%,T<0.8mm±5%

    Wall hole copper thickness

    >0.025mm(1mil)

    Finished hole

    0.2mm-6.3mm

    Min line width

    4mil/4mil(0.1/0.1mm)

    Min bonding pad space

    0.1mm(4mil)

    PTH aperture tolerance

    ±0.075mm(3mil)

    NPTH aperture tolerance

    ±0.05mm(2mil)

    Hole site deviation

    ±0.05mm(2mil)

    Profile tolerance

    ±0.10mm(4mil)

    Board bend&warp

    ≤0.7%

    Insulation resistance

    >1012Ωnormal

    Through-hole resistance

    <300Ωnormal

    Electric strength

    >1.3kv/mm

    Current breakdown

    10A

    Peel strength

    1.4N/mm

    Soldmask regidity

    >6H

    Thermal stress

    288℃20Sec

    Testing voltage

    50-300v

    Min buried blind via

    0.2mm(8mil)

    Outer cooper thickness

    1oz-5oz

    Inner cooper thickness

    1/2 oz-4oz

    Aspect ratio

    8:1

    SMT min green oil width

    0.08mm

    Min green oil open window

    0.05mm

    Insulation layer thickness

    0.075mm-5mm

    Aperture

    0.2mm-0.6mm

    Full Turn-Key service takes care of the entire process including PCB Fabrication, Component Procurement,PCB Assembly and testing. For customers who do not require the full Turn-Key solution then Partial Turn-Key will fit the bill.

    With Partial Turn-Key, you provide the blank PCBs and we assemble according to your requirements. You havethe option of providing some or all of the components, and Huaswin’s dedicated Procurement team

    will assist with any remaining parts.

    Testing:

    AOI (Automatic optical inspection)

    ICT(In-circuit test)

    Reliability test

    X-Ray Test

    Analogue and digital function test

    Firmware programming


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TEL: +86-755-26664885
Fax: +86-755-27898086
E-mail: sales@wellspcba.com
Address: 4th Floor,Building 12,No.3 Nangang Industial park ,Tangtou, Bao’an District, Shenzhen, Guangdong,China