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Multilayer PCB SMT DIP Service
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  • Product Category: PCB Assembly
  • product description:PCB Assembly Sample Introduction Product Details: Payment & Shipping Terms: Detailed Product Description Electro Mechanical Assembly PCBA for Equipment Control Mixed PCB Assembly Quick detail: Product Description Supply OEM Electronic circuit board assembly with high quality Material : FR4
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  • PCB Assembly Sample Introduction

    Product Details:

    Place of Origin:

    China

    Brand Name:

    OEM

    Certification:

    CE,ROHS, FCC,ISO9008,SGS,UL

    Model Number:

    OEM

    Payment & Shipping Terms:

    Minimum Order Quantity:

    1pcs

    Price:

    negotiation

    Packaging Details:

    inner: vacuum-packed bubble bag outer: carton box

    Delivery Time:

    5-10 days

    Payment Terms:

    T/T,Western union

    Supply Ability:

    1, 000, 000 PCS / week

    Detailed Product Description

    Material:

    FR4

    Layer:

    2

    Color:

    Green

    Min Line Space:

    5mil

    Min Line Width:

    5mil

    Copper Thickness:

    1OZ

    Board Size:

    200*105mm

    Panel:

    1

    Surface:

    HASL-LF



    Electro Mechanical Assembly PCBA for Equipment Control Mixed PCB Assembly
    Quick detail:

    Origin:China

    Special: PCB Assembly

    Layer:2

    Thickness:1.6mm

    Surface: HASL-LF

    Hole:0.8

    Product Description

    Supply OEM Electronic circuit board assembly with high quality

    Material : FR4 94v0 tg-130

    Layers (GERBER FILE) : 2 layers

    Board Thickness : 1.6mm

    Copper Thickness : 2oz

    Surface Treatment :HASL-LF

    Solder Mask : green

    Silk Screen : white

    Data File Format : gerber file andbill of material BOM

    Board size: 200*105mm

    Min. Hole Size : 0.15mm

    Hole Size Tolerance : +/-0.05mm (2 mil)

    Profile and V-Cut : v cut

    Special Process : Embedded Capacity

    PCB Assembly Details:

    Standard Component Sourcing Service

    Supplier →Components Purchase →IQC →Protection Control →Material Supply →Firmware

    Technical Requirement for PCB Assembly:

    v Professional Surface-mounting and Through-hole soldering Technology

    v Various sizes like 1206,0805,0603,0402,0201 components SMT technology

    v ICT(In Circuit Test),FCT(Functional Circuit Test) technology.

    v PCB Assembly With UL,CE,FCC,Rohs Approval

    v Nitrogen gas reflow soldering technology for SMT.

    v High Standard SMT&Solder Assembly Line

    v High density interconnected board placement technology capacity.

    PCB Assembly Manufacturing Procedures:

    vProgram Management

    PCB Files →DCC →Program Organizing →Optimization →Checking

    vSMT Management

    PCB Loader →Screen Printer →Checking →SMD Placement →Checking →Air Reflow →Vision Inspection →AOI →Keeping

    vPCBA Management

    THT→Soldering Wave (Manual Welding) →Vision Inspection →ICT →Flash →FCT →Checking →Package →Shipment

    Parameter:

    o

    Item

    Data

    1

    Layer:

    1 to 24 layers

    2

    Material type:

    FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers

    3

    Board thickness:

    0.20mm to 3.4mm

    4

    Copper thickness:

    0.5 OZ to 4 OZ

    5

    Copper thickness in hole:

    >25.0 um (>1mil)

    6

    Max. Board Size:

    (580mm×1200mm)

    7

    Min. Drilled Hole Size:

    4mil(0.1mm)

    8

    Min. Line Width:

    3mil (0.075mm)

    9

    Min. Line Spacing:

    3mil (0.075mm)

    10

    Surface finishing:

    HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating

    11

    Solder Mask Color:

    Green/Yellow/Black/White/Red/Blue

    12

    Shape tolerance:

    ±0.13

    13

    Hole tolerance:

    PTH: ±0.076 NPTH: ±0.05

    14

    Package:

    Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing

    15

    Certificate:

    UL,SGS,ISO 9001:2008

    16

    Special requirements:

    Buried and blind vias+controlled impedance +BGA

    17

    Profiling:

    Punching, Routing, V-CUT, Beveling

    PCB Assembly Capability

    Quantity

    Prototype&Low Volume PCB Assembly,from 1 Board to 250,is specialty,or up to 1000

    Type of Assembly

    SMT,Thru-hole, DIP

    Solder Type

    Water Soluble Solder Paste,Leaded and Lead-Free

    Components

    Passive Down to 0201 size
    BGA and VFBGA
    Leadless Chip Carriers/CSP
    Double-sided SMT Assembly
    Fine Pitch to 0.8mils
    BGA Repair and Reball
    Part Removal and Replacement

    Bare Board Size

    Smallest:0.25*0.25 inches
    Largest:20*20 inches

    File Formate

    Bill of Materials
    Gerber files
    Pick-N-Place file

    Types of Service

    Turn-key,partial turn-key or consignment

    Component packaging

    Cut Tape,Tube,Reels,Loose Parts

    Turn Time

    Same day service to 15 days service

    Testing

    Flying Probe Test,X-ray Inspection AOI Test


PCB Fabrication

PCB Assembly

Components Parts

IC Programming

Functional Testing

  Products
  Products
  Products

PCB Fabrication

PCB Assembly

Components Parts

IC Programming

Functional Testing

TEL: +86-755-26664885
Fax: +86-755-27898086
E-mail: sales@wellspcba.com
Address: 4th Floor,Building 12,No.3 Nangang Industial park ,Tangtou, Bao’an District, Shenzhen, Guangdong,China